MediaTek has unveiled its new Dimensity 9400 chip, targeting flagship Android smartphones with advanced AI capabilities.

Built on TSMC's second-generation 3nm process, the Dimensity 9400 boasts up to 40% greater power efficiency compared to its predecessor.

This processor is designed to compete with Qualcomm in the high-end mobile market, emphasizing support for generative AI features.

The introduction of this 5G mobile chipset marks a significant advancement for Android devices, particularly in integrating artificial intelligence.

The chipset supports AI video generation, providing a framework for autonomous application development.

A new AI unit within the processor can potentially double performance for various tasks, depending on the AI model utilized.

For connectivity, the Dimensity 9400 includes Wi-Fi 7, Bluetooth 5.4, and an advanced 5G modem capable of peak download speeds of 7GB/s.

In terms of graphics, the chip features a 12-core Immortalis G925 GPU, delivering a 41% increase in performance and enhancing ray tracing capabilities by 40%.

The chipset integrates on-device AI, along with a new ISP and NPU, significantly improving power efficiency.

Audio capabilities are enhanced with support for up to six microphones and 24-bit audio recording, utilizing AI for noise reduction.

Mass production of the Dimensity 9400 is expected in the latter half of 2024, with major PC manufacturers like Lenovo, Dell, HP, and Asus showing interest.

Looking ahead, the adoption of agentic AI across various brands is anticipated by 2025, although questions about its effectiveness remain.