These processors claim to deliver 14% to 36% lower power consumption during gaming compared to competing chipsets, making them efficient for mobile gaming.

MediaTek has unveiled three new chipsets, the Dimensity 7400, 7400X, and 6400, aimed at enhancing mid-range smartphones with advanced features ahead of Mobile World Congress 2025.

The Dimensity 7400 and 7400X are designed for gaming and AI camera processing, positioned just below the flagship Dimensity 9400 and premium 8400.

Both the Dimensity 7400 and 7400X feature an octa-core CPU, built on TSMC’s 4nm process, with four Cortex-A78 cores clocked at 2.6GHz and four Cortex-A55 cores at 2.0GHz.

The 7400 is tailored for standard smartphones, while the 7400X is optimized for foldable devices, supporting dual-display flip-phones.

Connectivity features include a 5G R16 modem with 3CC carrier aggregation and tri-band Wi-Fi 6E, ensuring high-speed wireless performance.

Both models incorporate a sixth-generation NPU, which enhances gaming performance by reducing input lag through optimized settings.

The new NPU offers 15% improved performance over the previous generation, enhancing photography with AI-driven features like Google Ultra HDR.

The Dimensity 6400, a more budget-friendly option, includes a 6nm octa-core processor with Bluetooth Wi-Fi HyperCoex Technology, reducing gaming latency by up to 90%.

This lower-performance chipset supports 2CC carrier aggregation and can handle 10-bit images and cameras up to 108MP.

While the Dimensity 6400 devices are already available, the first smartphones featuring the 7400 and 7400X are expected to launch in early 2025.

All chipsets include MediaTek Advanced Gaming Technology 3.0, which enhances gameplay and graphics while improving power efficiency.