Broadcom Unveils 3.5D XDSiP Tech to Boost AI Chip Performance, Ups Revenue Forecast to $12 Billion

December 5, 2024
Broadcom Unveils 3.5D XDSiP Tech to Boost AI Chip Performance, Ups Revenue Forecast to $12 Billion
  • Although Broadcom has not disclosed specific clients, analysts suggest that major tech firms like Alphabet's Google and Meta Platforms are likely among its custom chip customers.

  • Marvell is recognized as Broadcom's main competitor in the custom chip market, which is projected to reach approximately $45 billion by 2028.

  • Both Broadcom and Marvell are expected to benefit from this expanding market, particularly due to the rising demand for AI clusters from hyperscale companies.

  • As the custom chip market continues to grow, both Broadcom and Marvell are well-positioned to capitalize on the opportunities presented by this trend.

  • On December 5, 2024, Broadcom announced the development of a new technology called 3.5D XDSiP, designed to enhance semiconductor speeds for AI processors amid increasing demand.

  • Broadcom's CEO, Hock Tan, revealed that the company's AI revenue forecast for fiscal year 2024 has been raised to $12 billion, reflecting the growing scale of AI clusters among hyperscale customers.

  • This innovative technology allows customers to boost memory capacity within packaged chips and improves performance by directly connecting critical components.

  • The company employs advanced manufacturing processes from TSMC, including chip-on-wafer-on-substrate techniques, which are currently constrained and represent a bottleneck in the AI chip supply chain.

  • These advanced manufacturing processes are critical as they support Broadcom's efforts to meet the rising demand for AI chips, despite their limited production capacity.

  • Tan noted that Broadcom has three primary customers for its custom processor unit, underscoring the increasing need for advanced AI infrastructure.

  • This revised forecast is an increase from an earlier estimate of $11 billion, highlighting the significant demand from major tech companies.

  • Broadcom is currently developing five products utilizing the 3.5D XDSiP technology, with production shipments slated to begin in February 2026.

Summary based on 6 sources


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